E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 20.19mm, Width: 5.01mm, Depth: 10.16mm, Dimensions: 20.19 x 5.01 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOC-316-T051-99